Highly conductive silver paste for tempering & laminating applications
A highly conductive unleaded silver paste specially developed for low fi re laminating and tempering applications, overprinting IR and UV glass enamels.
A dark silver paste, AG 330L is especially suitable in applications calling for lower firing and improved heat absorption.
AG 330L is also suitable for unleaded soldering applications.
Silver content: 60 %
Viscosity specifi cation (Pa.S): 26 ± 3
Fineness of grind: < 25 μm
Pullstrength on glass: > 200 N
Drying Speed: Slow
Reverse colour: Dark-brown